Thin Film Coating

  • PECVD/CVD/E-Beam
  • ICP/RIE System
  • Thermal Evaporator
  • Plasma System For - Ashing , Cleaning , Activation , Etching and Coating System
  • Equipment Flip Chip Bonder
  • Surface Profiler
  • Wafer Inspection System
  • Various tube & Box Furnaces
  • Laser Marking Machine
  • LTCC & HTCC Procesing Equipments
  • Mask Aligners and Writers
  • Wafer Cutting Tool
Wafer Cutting Machine
Thin Film Measurement System
Flip Chip Bonder
Mask Aligner System
Mask Aligner System
Plasma Cleaner System
Email: kristine@bosonelectronics.co.in